E10: EMC for IC, PCB and Package (1)

Thursday, August 21  08:00-09:40,  Room #15

Session Chair: ERPING LI

Rapid growth and convergence of digital computing and wireless communication have resulted in complex EMC which cannot be easily addressed by conventional methods. This session will address the various techniques for modeling and simulation of EMC problems, such as Signal integrity/power integrity, numerical modeling of automotive EMC, aerospace EMC, integrated circuit EMC. In addition, the material property on electromagnetic performance, aging effects, thermal-electrical coupling.

8:00  E10.1   CAPACITIVE COUPLING ANALYSIS OF TSV ARRAY IN 3D PACKAGING

G. Luo1, E. Li2, X. Wei2, X. Cui1

1School of Electrical and Electronic Engineering, North China Electric Power University, Beijing, China
2Cyber Innovation Joint Research Center, Zhejiang University, Hangzhou, China


8:20  E10.2   PACKAGE DESIGN METHODOLOGY IN CONSIDERATION WITH SIGNAL INTEGRITY, POWER INTEGRITY AND ELECTROMAGNETIC IMMUNITY

B. Pu, K. Kim, W. Nah

Department of Electrical and Electronic Engineering, EMC Laboratory, Sungkyunkwan University, Suwon, South Korea


8:40  E10.3   A NEAR-FIELD TO FAR-FIELD TRANSFORMATION METHOD RESEARCH BASED ON INTERFERENCE SOURCE RECONSTRUCTION

M. Zhang

EMC LAB, Beihang University, BEIJING, China


9:00  E10.4   ANALYSIS OF MULTIPLE VIAS COUPLING IN SILICON INTERPOSER BY USING CYLINDRICAL MODE EXPANSION METHOD

J. Li

Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China


9:20  E10.5   SYSTEM TO CHIP-LEVEL EMC/EMI TESTBED BASED ON MINIATURIZED ACTIVE OPTICAL NEAR-FIELD TIME DOMAIN SENSORS

S. Kühn1,2, B. Kochali2, E. Grobbelaar2, N. Kuster1,3

1IT'IS Foundation, ETH Zurich, Zurich, Switzerland
2SPEAG, Zurich, Switzerland
3ITET, ETH Zurich, Zurich, Switzerland